UV Release Tape
- It has high adhesion, which prevents the die from moving and allows for easy removal after UV debonding.
- It uses easily recyclable PO and PET as substrates.
Features
- Temporary adhesive tape for semiconductor manufacturing (wafer back grinding, wafer production process).
- Processing of passive components, such as grinding of glass substrates during the production process → Prevent components from falling off or scattering during grinding and production process. After completion, exposure to UV allows the tape to be easily removed from the components.
- Protective tape for wafer circuit surfaces → Temporarily protects the surface of the wafer from scratches or damage during manufacturing (thermal processing, metal sputtering), storage, and transportation of the chips.
